S250/S450 TRANSFER MOLDING PRESS-Nextool Technology Co., Ltd.

S250/S450 TRANSFER MOLDING PRESS

For post process packing of IC, semiconductor devices and LED substrates. The main applicable product packing forms are small spacing products like TO, DIP, SOP, SOT, SOD, SMA, SMB, QFP, IPM, LED and etc., matching with MGP mold and traditional single mold. By using servo oil pump technology to realize high efficiency energy saving.

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Details Specification Packaging

Multi-option function configuration, suitable for customize product needs from different users:Slow injection function and ultra-slow clamping function module.

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Mould protection system.

T+TA function.

Thimble Oil System.

Mould vacuum system.

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