For post-process packaging of integrated circuits and semiconductor devices.
In conjunction with the automatic packaging system for packaging, one mold box can package two strips. The multi-injection head packaging method enables short-distance filling and effectively prevents glue overflow.
240t AUTO MOLDING SYSTEM
120/180/180tx1/240t AUTO MOLDING SYSTEM
PLP/WLP80 COMPRESSION MOLDING ENCAPSULATION EQUIPMENT
AUTO MGP SYSTEM
DIE SYSTEM
CALIBRATOR SYSTEM
WATER TANK SYSTEM
EXTRUSION TOOLING
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