120/180/180x1 AUTO MOLDING SYSTEM 价格：

For post-process packaging of IC,semiconductor devices and LED substrates.The applicable product packaging forms are：SOP、SOT、SOD、SMA、SMB、 SMC、 DFN、QFN、QFB、BGA、CSP、PLCC、MCM、IGBT、IPM、TO、LED substrates and etc.

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