For post-process packaging of IC,semiconductor devices and LED substrates.The applicable product packaging forms are：SOP、SOT、SOD、SMA、SMB、 SMC、 DFN、QFN、QFB、BGA、CSP、PLCC、MCM、IGBT、IPM、TO、LED substrates and etc.
Auto molding system includes lead frame alignment unit, strip preheating unit, resin supply unit, feeding manipulator, blanking manipulator, press unit, blanking punching unit and product output collection unit.
240t AUTO MOLDING SYSTEM
PLP/WLP80 COMPRESSION MOLDING ENCAPSULATION EQUIPMENT
AUTO MGP SYSTEM
Mold head system
Fixed system
Water tank system
Extrusion molding device
Co extrusion technology mold
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