About us

Anhui Nextool Technology Co., Ltd. was established in October 2005. The company specializes in the R&D, production, and sales of intelligent manufacturing equipment for plastic extrusion molding and semiconductor packaging. It provides customers with customized intelligent manufacturing equipment and system solutions. Its main products include plastic extrusion molding dies, extrusion molding devices and downstream equipment, as well as semiconductor packaging equipment and dies. The company holds a registered capital of RMB 114.55 million. Leveraging its comprehensive R&D system and sustained innovation capabilities, it has secured over 100 patents. Advanced processing equipment imported from Switzerland, Japan, and Germany—including four-axis wire cutting and EDM machines, high-speed graphite electrode milling machines, machining centers, and mirror grinders—alongside precision inspection tools such as German ZEISS coordinate measuring machines and coordinate imaging systems, ensures micron-level manufacturing accuracy. Through in-depth research into plastic extrusion principles, plastic melt rheology theory, and mechatronics integration, the company has systematically mastered core plastic extrusion technologies. It continuously designs and develops plastic extrusion molds, extrusion equipment, and downstream machinery tailored to customer needs. Leveraging unique design concepts, mature process technologies, superior product quality, extensive commissioning experience, and comprehensive after-sales service, our products are exported to 40 countries worldwide. We have served numerous international brands for years, including Germany's Aluplast Group, Profine Group, and REHAU Group; Belgium's Deceuninck Group; and the United States' Austroplast, Eastern Fence, and PLYGEM Group. Leveraging mastered core technologies in plastic forming principles, precision mechanical design and manufacturing, and electrical automation control, the company has successfully developed fully automated semiconductor packaging systems, fully automated trimming and forming systems, molds, and related equipment through its comprehensive R&D system and continuous innovation capabilities. These solutions are primarily applied in precision packaging for integrated circuits and discrete devices. The company supplies semiconductor packaging equipment and molds to leading domestic semiconductor enterprises including Tongfu Microelectronics (002156), Huada Technology (002185), and Jiangsu JSC (600584)—all among the world's top ten semiconductor packaging and testing firms—as well as Wuxi Qiangmao Electronics and Jingdao Microelectronics. It stands as one of the few domestic suppliers of semiconductor packaging equipment and molds. The company is certified as a National High-Tech Enterprise, an Anhui Provincial Innovative Enterprise, and an Anhui Provincial Specialized, Refined, Distinctive, and Innovative SME. It operates an Anhui Provincial-recognized Enterprise Technology Center and has established a postdoctoral research workstation. In November 2018, the company was designated a “Manufacturing Single-Item Demonstration Enterprise (2019-2021)” by the Ministry of Industry and Information Technology (MIIT) and the China Federation of Industrial Economics. In November 2021, the company passed the MIIT's re-evaluation and was listed in the third batch of manufacturing single-champion enterprises. It undertook the 2018 Anhui Provincial Major Science and Technology Special Project “NTASM200 Integrated Circuit Automatic Packaging System.” In 2019, the company received the honorary title of “Key Mold Export Enterprise for 2017-2020” from the China Die & Mold Industry Association. In 2020, the company received the “Anhui Provincial Science and Technology Second Prize—Key Technologies and Industrialization of Intelligent Extrusion Molding Equipment” from the Anhui Provincial People's Government and the honorary title of “China Key Backbone Mold Enterprise for Plastic Profile Extrusion Molds” from the China Die & Mold Industry Association. Its product “Fully Automatic Packaging System AMS120-PS” was honored as “2020 Anhui Provincial First-of-a-Kind Major Technical Equipment”; In 2021, the company was honored as a “2020-2021 China Semiconductor Development Potential Packaging and Testing Equipment Enterprise” by the organizing committee of the China International Semiconductor Packaging and Testing Conference and was elected as a council member of the National Integrated Circuit Packaging and Testing Industry Chain Technology Innovation Strategic Alliance. Guided by its mission to “create greater value for customers” and its business philosophy of “sustainability, innovation, collaboration, and harmony,” the company is committed to satisfying customers through cutting-edge technology, impeccable quality, and prompt, attentive service, thereby promoting the healthy and sustainable development of China's intelligent manufacturing equipment industry.