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240t AUTO MOLDING SYSTEM 价格:

For post-process packaging of IC,semiconductor devices and LED substrates.The applicable product packaging forms are:SOP、SOT、SOD、SMA、SMB、 SMC、 DFN、QFN、QFB、BGA、CSP、PLCC、MCM、IGBT、IPM、TO、LED substrates and etc.

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Details Specification Packaging

Auto molding system includes lead frame alignment unit, strip preheating unit, resin supply unit, feeding manipulator, blanking manipulator, press unit, blanking punching unit and product output collection unit.

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The 240t press independent unit supports dual mold chases, enabling the molding of four lead frame products in a single cycle. 

With three press stations, up to 12 lead frame products can be molded simultaneously, maximizing packaging capacity.

The 240t press unit is customized to a single-row barrel high-injection molding encapsulation structure,meeting the requirements of 2.5D IC and 3D IC integrated chiplet products.

The 240t press unit can be customized to a single mold chase dual injection encapsulation structure, meeting the requirements of high resin consumption and ensuring full encapsulation for dual lead frame or substrate-based packaging products when a single-row EMC injection is insufficient.


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