120/180/180tx1/240t AUTO MOLDING SYSTEM-Nextool Technology Co., Ltd.

120/180/180tx1/240t AUTO MOLDING SYSTEM

For post-process packaging of IC,semiconductor devices and LED substrates.The applicable product packaging forms are：SOP、SOT、SOD、SMA、SMB、 SMC、 DFN、QFN、QFB、BGA、CSP、PLCC、MCM、IGBT、IPM、TO、LED substrates and etc.

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Auto molding system includes lead frame alignment unit, strip preheating unit, resin supply unit, feeding manipulator, blanking manipulator, press unit, blanking punching unit and product output collection unit.

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